Toshiba didn't disclose any details about the lithography, but I would them to use single patterning, which would put the litho somewhere between 35nm and 50nm.
Is anyone planning on using their 1x process node in their 3D NAND products? Wouldn't that enable them to create drives with $/GB densities similar to HDDs?
The smaller the structures are, the harder it gets to etch those many-layer structures. It will be interesting to see if anyone transitions to smaller lithography while keeping the number of layers constant.
Sandisk today cut their financial outlook and delayed their Investor Day so the timing for significant volume production might be in flux.If they are in trouble in enterprise and they are supply constrained overall ,they might try to launch this sooner.
Thats hardly surprising. Samsung has been shipping 32 layer for half a year. Everyone else has been experimenting with their own variations of 3D NAND for over a year as well. Now they all want to get products out to customers ASAP, and so here come the announcements. Just watch though. At least some of these announcements will give and estimated delivery time frame, but expect those to slide backwards significantly as time goes by. Eventually though, all of these companies will release products using their variation of 3D technology.
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blanarahul - Thursday, March 26, 2015 - link
So, I guess we won't see BX100 class SSDs using 3D NAND before 2017. Well atleast we'll have PCIe SSDs till then.blanarahul - Thursday, March 26, 2015 - link
I am not taking from a buyer's perspective. I am just talking in general, or so I believe.MrSpadge - Thursday, March 26, 2015 - link
Any information on die size and lithography would be welcome.hojnikb - Thursday, March 26, 2015 - link
Any idea what process node this will be using ?psychobriggsy - Thursday, March 26, 2015 - link
Well Samsung's is on a 30-40 nm process, so I imagine this is too, given the capacities. This should mean it has a longer lifetime.melgross - Thursday, March 26, 2015 - link
It does say 15nm.deathwombat - Thursday, March 26, 2015 - link
It says that Toshiba has 15 nm planar NAND. It doesn't say what node they use for their 3D NAND.Kristian Vättö - Thursday, March 26, 2015 - link
Toshiba didn't disclose any details about the lithography, but I would them to use single patterning, which would put the litho somewhere between 35nm and 50nm.sonicmerlin - Thursday, March 26, 2015 - link
Is anyone planning on using their 1x process node in their 3D NAND products? Wouldn't that enable them to create drives with $/GB densities similar to HDDs?MrSpadge - Thursday, March 26, 2015 - link
The smaller the structures are, the harder it gets to etch those many-layer structures. It will be interesting to see if anyone transitions to smaller lithography while keeping the number of layers constant.jjj - Thursday, March 26, 2015 - link
Sandisk today cut their financial outlook and delayed their Investor Day so the timing for significant volume production might be in flux.If they are in trouble in enterprise and they are supply constrained overall ,they might try to launch this sooner.Khato - Thursday, March 26, 2015 - link
Haha, and what happens soon after this announcement by Toshiba? Intel/Micron announcing their entry into 3D NAND of course.Mark_gb - Thursday, March 26, 2015 - link
Thats hardly surprising. Samsung has been shipping 32 layer for half a year. Everyone else has been experimenting with their own variations of 3D NAND for over a year as well. Now they all want to get products out to customers ASAP, and so here come the announcements. Just watch though. At least some of these announcements will give and estimated delivery time frame, but expect those to slide backwards significantly as time goes by. Eventually though, all of these companies will release products using their variation of 3D technology.