Samsung has not said. But since it's a packaging optimization rather than a die optimization, there's no reason to think it's not available in their current speed grades.
I belive it should be 8,5 Gb/s. nothing crazy, but decent. as others said not confirmed. I think they are used on CAMM modules, for example. I wonder if they want to make CAMM as thin as possible, so they can use them instead of soldered in laptops.
We’ve updated our terms. By continuing to use the site and/or by logging into your account, you agree to the Site’s updated Terms of Use and Privacy Policy.
Facebook
Twitter
RSS
7 Comments
Back to Article
Lodix - Monday, August 5, 2024 - link
At what speed are this running?Ryan Smith - Monday, August 5, 2024 - link
Samsung has not said. But since it's a packaging optimization rather than a die optimization, there's no reason to think it's not available in their current speed grades.deil - Tuesday, August 6, 2024 - link
I belive it should be 8,5 Gb/s. nothing crazy, but decent. as others said not confirmed.I think they are used on CAMM modules, for example.
I wonder if they want to make CAMM as thin as possible, so they can use them instead of soldered in laptops.
Dante Verizon - Tuesday, August 6, 2024 - link
Wouldn't it sound better to say improved heat dissipation or greater thermal conductivity?"21.2% improvement in heat resistance."
Maybe it's just me, but it sounds a bit ambiguous
ballsystemlord - Tuesday, August 6, 2024 - link
I agree with you.FreckledTrout - Wednesday, August 7, 2024 - link
That airflow inside the phone :)Terry_Craig - Wednesday, August 7, 2024 - link
Laptops also use LPDDR5X, in addition, in smartphones heat dissipation becomes more efficient.