Comments Locked

9 Comments

Back to Article

  • dwillmore - Thursday, September 28, 2023 - link

    Do the continued references to "monolithic dies" mean? As opposed to maybe a stacked die setup? Thanks.
  • FWhitTrampoline - Thursday, September 28, 2023 - link

    Yes that wording and usage there is odd as maybe that should be planar as opposed to 3D/3D stacked.
  • dwillmore - Thursday, September 28, 2023 - link

    Thank you.
  • FWhitTrampoline - Thursday, September 28, 2023 - link

    Just so you Know ASML has a backlog of DUV machine orders to fill just like it still has a backlog of EUV orders. But EUV replaces many DUV steps with a single EUV step so EUV reduces the wafer started to wafer completed timeline and thus increases productivity. And can we get a 1β (1-beta) manufacturing process to nanometer processor translation there to reduce the Marketing Obfuscation.
  • dotjaz - Thursday, September 28, 2023 - link

    It's 12nm-class. 1β is the 5th D1* node and it started with 18. Your choice of numbers are quite limited since there will be a 1γ.
  • GreenReaper - Friday, September 29, 2023 - link

    64GB ought to be enough for anybody!
  • atragorn - Friday, September 29, 2023 - link

    640kb should be enough !
  • torbendalum - Tuesday, October 3, 2023 - link

    Wrong, where I work our Database servers have 8TB Ram each and they need it.
  • kobblestown - Wednesday, October 4, 2023 - link

    "64GB ought to be enough for anybody!"

    Only if it's on a single module and I have at least 4 memory channels :D

Log in

Don't have an account? Sign up now