"These dies, in turn, would be connected using 3μm bond pitche ssilicon vias (TSVs), three times the density of the size of today's 9μm pitch." Should read: "These dies, in turn, would be connected using 3μm bond pitch through-silicon vias (TSVs), three times the density of the size of today's 9μm pitch."
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ballsystemlord - Friday, May 31, 2024 - link
Spelling mistake:"These dies, in turn, would be connected using 3μm bond pitche ssilicon vias (TSVs), three times the density of the size of today's 9μm pitch."
Should read:
"These dies, in turn, would be connected using 3μm bond pitch through-silicon vias (TSVs), three times the density of the size of today's 9μm pitch."