"Also, it can theoretically be used to create patterned media for hard disk drives."
I like this comment! It suggests a possible economic niche where the tech can get started, and a path to generally available patterned media (which are required for the next big jump in magnetic media capacity).
Sorry I think this is a translation error, my understanding is that it might actually referred to SSD and HDD.
The fact that HDD is more like a ribbon, Nanoimprint required a great deal of accuracy to work, I don't think you can cost effectively produce a disk structure i.e. from inside to outside that same shape, think of simple things like printing a T-shirt, how to fill a circle going larger and larger only a square can do it. And HDD has a very large surface compare to CPU let say.
SSD and RAM is what Canon said they target for, largely repeated i.e. using AI and computer, this technology line up right next to the next RAM cell in a continuous manner in increasing capacity. Therefore
"... NIL often involves processing smaller areas sequentially. ..."
The keyword is sequentially, i.e. like you stamp on a maze pattern and you carry on stamping until it create a much larger maze, i.e. more RAM.
The thing that I think Canon should sell to except the plan to Samsung, Micron, etc. (Memory), I think if they can create a mold that is large enough, is to Intel for Backside Power Delivery, I really do think that because of High K material and so on, the thing is difficult but of the back side, it is only coper and some form of non conductive material, the shape is also simple to be imprint, unlike GAA CFET these complex shape can kill imprint, like imprint T-Shirt with multiple colour, but if copper and the insulative material is only 2 colour, then in theory is simpler and compare to ASML nanoimprint is cheaper in total cost of ownership.
This has been done for years. The compony Canon purchased for the Nanoimprint technology was doing this back in 2009 to print patterned media for HDD companies.
That wasn’t a market release, but an announcement that they provided it to Toshiba Memory. What’s new is that it now appears to be generally available.
DUV and in particular EUV masks need to be immaculate though, which is why they are made via the slow but super precise electron beam lithography. Would a defect-prone lithography be suitable for them? A single mask defect would pass that defect in all the printed wafers.
The obvious market would be the companies without EUV, or even better, countries like India who want to start building their own fabs. They can bypass the entire ASML wait list.
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name99 - Tuesday, October 17, 2023 - link
"Also, it can theoretically be used to create patterned media for hard disk drives."I like this comment! It suggests a possible economic niche where the tech can get started, and a path to generally available patterned media (which are required for the next big jump in magnetic media capacity).
my_wing - Sunday, October 29, 2023 - link
Sorry I think this is a translation error, my understanding is that it might actually referred to SSD and HDD.The fact that HDD is more like a ribbon, Nanoimprint required a great deal of accuracy to work, I don't think you can cost effectively produce a disk structure i.e. from inside to outside that same shape, think of simple things like printing a T-shirt, how to fill a circle going larger and larger only a square can do it. And HDD has a very large surface compare to CPU let say.
SSD and RAM is what Canon said they target for, largely repeated i.e. using AI and computer, this technology line up right next to the next RAM cell in a continuous manner in increasing capacity. Therefore
"... NIL often involves processing smaller areas sequentially. ..."
The keyword is sequentially, i.e. like you stamp on a maze pattern and you carry on stamping until it create a much larger maze, i.e. more RAM.
The thing that I think Canon should sell to except the plan to Samsung, Micron, etc. (Memory), I think if they can create a mold that is large enough, is to Intel for Backside Power Delivery, I really do think that because of High K material and so on, the thing is difficult but of the back side, it is only coper and some form of non conductive material, the shape is also simple to be imprint, unlike GAA CFET these complex shape can kill imprint, like imprint T-Shirt with multiple colour, but if copper and the insulative material is only 2 colour, then in theory is simpler and compare to ASML nanoimprint is cheaper in total cost of ownership.
Eskimou - Saturday, December 16, 2023 - link
This has been done for years. The compony Canon purchased for the Nanoimprint technology was doing this back in 2009 to print patterned media for HDD companies.https://sst.semiconductor-digest.com/2009/09/hdd-p...
Threska - Tuesday, October 17, 2023 - link
"It uses a mask, embossed with the circuit pattern, which directly presses against the resist on the wafer. "Contact printing.
lefty2 - Tuesday, October 17, 2023 - link
Is this some type of marketing reboot? The FPA-1200NZ2C was released 6 years ago according to this: https://global.canon/en/news/2017/20170720.htmlThe Hardcard - Tuesday, October 17, 2023 - link
That wasn’t a market release, but an announcement that they provided it to Toshiba Memory. What’s new is that it now appears to be generally available.lefty2 - Wednesday, October 18, 2023 - link
not really. other companies were using it 6 years ago: https://semiengineering.com/what-happened-to-nanoi...The Hardcard - Friday, October 20, 2023 - link
No, there is only one Toshiba. Both your links refer to the same machine.Anymoore - Tuesday, October 17, 2023 - link
Canon's NIL is sequentially stepped just like ASML scanners, so there is no serial vs. non-serial.Using NIL for DUV/EUV masks is an interesting proposition, it would actually be harder because the pattern would cover a larger area.
Santoval - Wednesday, November 8, 2023 - link
DUV and in particular EUV masks need to be immaculate though, which is why they are made via the slow but super precise electron beam lithography. Would a defect-prone lithography be suitable for them?A single mask defect would pass that defect in all the printed wafers.
Anymoore - Wednesday, October 18, 2023 - link
The obvious market would be the companies without EUV, or even better, countries like India who want to start building their own fabs. They can bypass the entire ASML wait list.nandnandnand - Wednesday, October 18, 2023 - link
Chyna has entered the chat.Dante Verizon - Wednesday, October 18, 2023 - link
It would be helpful in reducing costs as well. ASML has a monopoly on its hands.PeachNCream - Wednesday, October 18, 2023 - link
Canon still exists! Interesting.