Where is wire bonding of "conventional" 3D NAND applied, between the edges of the dies? And are the wires really vertical like TSVs or do they curve somewhat around these edges (though I understand that any curve at such extremely close distances would probably be negligibly tiny)? If I've understood correctly wire bonding never pierces the dies at any point, not even at the edges, correct?
Wire-bonded die stacks are staggered so that the edges with the contacts are exposed. 16-die stacks typically are packaged as two 8-die stacks with the upper half rotated 180 degrees.
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plopke - Friday, July 14, 2017 - link
MOOOOOOOOOOORE, MOOOOOOOORE and DDR4 to drop prices plzSantoval - Friday, July 14, 2017 - link
Where is wire bonding of "conventional" 3D NAND applied, between the edges of the dies? And are the wires really vertical like TSVs or do they curve somewhat around these edges (though I understand that any curve at such extremely close distances would probably be negligibly tiny)? If I've understood correctly wire bonding never pierces the dies at any point, not even at the edges, correct?Ryan Smith - Saturday, July 15, 2017 - link
Correct. Wire bonding is always bonding at the edge.Billy Tallis - Saturday, July 15, 2017 - link
See pictures at http://www.eetimes.com/author.asp?section_id=36&am... and at http://images.anandtech.com/doci/10481/Figure-1.jp...Wire-bonded die stacks are staggered so that the edges with the contacts are exposed. 16-die stacks typically are packaged as two 8-die stacks with the upper half rotated 180 degrees.
LuckyWhale - Friday, July 14, 2017 - link
The end draws ever closer for the traditional rotating HDDs.